Enabling Simultaneously Bi-directional TSV Signaling For Energy And Area Efficient 3D-ICs

Park S., A. Wang, U. Ko, L. Peh, A. P. Chandrakasan, "Enabling simultaneously bi-directional TSV signaling for energy and area efficient 3D-ICs," In Proceedings of Design Automation and Test in Europe (DATE), Dresden, Germany, March 2016.